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Antec Formula 6 Thermal Compound for Heatsinks, 4g

Antec Formula 6 Thermal Compound for Heatsinks, 4g

 

Part #: ACC-AF6

Availability: In Stock

Shipping: Usually ships within 1 business day

Our Price:
$6.99 

  Qty:

 

Antec's Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C.

Top Specifications
  • Specific Gravity: 2.2 g/cm3
  • Diamond particles measuring 0.0000015 cm
  • Thermal Conductivity: 5.3 W/mK
  • Thermal Limits: -30°C to 250°C
  • Lighter, easier to spread stable composition won't crack or dry out
  • Quantity: 4 grams
Top Warranty and Manufacturer Information

Manufacturer: Antec - FORMULA 6
Warranty: Consumable item; No Warranty


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