Antec Formula 6 Thermal Compound for Heatsinks, 4g

Antec's Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C.

• Specific Gravity: 2.2 g/cm3
• Diamond particles measuring 0.0000015 cm
• Thermal Conductivity: 5.3 W/mK
• Thermal Limits: -30°C to 250°C
• Lighter, easier to spread stable composition won't crack or dry out
• Quantity: 4 grams

Manufacturer: Antec - FORMULA 6
Warranty: Consumable item; No Warranty